Technical Specifications
| Parameter Name | Parameter Value |
|---|---|
| Product Model | 259B2460BTG2 |
| Manufacturer | General Electric (GE / GE Fanuc) |
| Ordering Code | 512AZSPBPAC-100 (ICS Rack ASM, EMI, VMIC, RES) |
| Product Type | Controller Rack / VME Protection Rack Chassis with Backplane Assembly |
| System Compatibility | GE Mark VI Speedtronic Turbine Control (IS200 series hardware) |
| Bus Architecture | VMEbus (IEEE 1014), passive parallel backplane distribution |
| Backplane Capacity | 21 female VME backplane connectors (via installed backplane board) |
| I/O Interface | 39 front-facing I/O headers for ribbon cable field wiring |
| Companion Backplane Board | IS200BPVCG1BR1 Backplane ASM Board |
| Supply Voltage | 24 V DC nominal, distributed via backplane (external supply modules required) |
| Form Factor | 19-inch rack compatible (EIA-310), 4U class chassis |
| Chassis Construction | Industrial-grade metal chassis with integrated EMI/RFI shielding |
| Cooling Provision | Multiple 92 mm fan positions for forced-air cooling |
| Grounding | Dual M6 threaded grounding studs on rear panel structure |
| Operating Temperature | 0 °C to +60 °C |
| Storage Temperature | -40 °C to +85 °C |
| Relative Humidity | 5 % to 95 %, non-condensing |
| Dimensions (W × D × H) | Approx. 430 × 480 × 580 mm |
| Weight | Approx. 4 – 5 kg |
| Country of Origin | United States |
Main Features and Advantages
Passive backplane architecture for deterministic signal integrity: The GE 259B2460BTG2 works with a multilayer PCB backplane whose parallel trace routing is optimised for VMEbus communication velocity and signal synchronisation. Layered copper planes inside the board deliver continuous electromagnetic shielding and controlled impedance for high-speed data exchange between the bus master controller, I/O cards and communication interfaces. Because the backplane is a passive distribution network, it introduces no firmware, no configuration and no additional failure mode of its own, which is exactly what a protection-grade platform should do.Robust 24 V DC power distribution: The heavy copper power rails on the backplane minimise localised IR voltage drop across slot positions and suppress transient noise generated by module insertion or load switching. The GE 259B2460BTG2 therefore maintains stable logic voltage at every card even during demanding load changes, reducing the nuisance resets and intermittent contact faults that plague loosely wired control panels.EMI shielding and grounding discipline: Turbine halls are electrically hostile environments, filled with high-power drives, excitation equipment and switching transients. The GE 259B2460BTG2 counters this with an EMI-shielded metal enclosure, a resistor framework for noise suppression, and dual M6 grounding studs that take a direct copper braid connection to the plant instrumentation grounding grid to drain stray high-frequency currents safely.Mechanical resilience and serviceability: Card guides and retention borders lock each module into precise alignment with the pin-and-socket backplane connectors, maintaining low contact resistance and preventing crosstalk during thermal expansion cycles. The modular layout of the GE 259B2460BTG2 allows controller and I/O boards to be installed, upgraded or replaced quickly, which directly reduces mean time to repair during an outage.Long-term platform support: The GE 259B2460BTG2 is dimensioned and electrically specified to host the complete IS200 series Mark VI module family, from bus master controllers to terminal boards, making it the correct choice for sustaining legacy installations and for Mark V to Mark VI retrofit projects where backplane infrastructure must be renewed.
Reviews
There are no reviews yet.