Product Description

The CR-GEN0-M6400R​ is a high-resolution area scan industrial camera manufactured by DALSA (now part of Teledyne Technologies), a pioneer in digital imaging and machine vision. This camera belongs to the category of high-performance machine vision sensors, designed to capture extremely detailed images for applications where precision is paramount. It serves as the critical “eye” of an automated inspection system, transforming visual information into digital data for analysis, measurement, and decision-making.

Application Scenarios

In a flat panel display (FPD) manufacturing facility, detecting micron-level defects in the intricate transistor layers is a monumental challenge. Traditional cameras lacked the resolution to distinguish between a harmless particle and a catastrophic short circuit. This is where the CR-GEN0-M6400R​ proves its worth. Mounted on a high-precision motion stage, the camera captures a single, massive 30.7-megapixel image of a panel section. Its large 47.36mm sensor and 7.4-micron pixels provide such exceptional detail that advanced vision software can automatically identify and classify sub-pixel defects like micro-scratches, color inconsistencies, and pattern deformations. The CR-GEN0-M6400R​ directly addresses the core pain points of yield loss and quality assurance in high-value manufacturing, enabling 100% automated inspection at a resolution that was previously unattainable, ensuring that only flawless products proceed to assembly.

Technical Principles and Innovative Values

The CR-GEN0-M6400R​ is engineered not just for high pixel count, but for delivering measurable, reliable image data under industrial constraints.

Innovation Point 1: Large Sensor with Optimal Pixel Size for Metrology-Grade Accuracy.​ The camera’s defining feature is its massive 47.36mm diagonal sensor paired with a 7.4-micron pixel pitch. This combination provides a vast field of view while maintaining a high pixel density. For measurement applications, this translates directly into superior spatial resolution and lower sub-pixel error. A single image can cover a large area (e.g., an entire circuit board panel) while still resolving features down to a few microns, eliminating the need for complex image stitching in many cases and speeding up inspection cycles.

Innovation Point 2: Camera Link Interface for Uncompressed, High-Bandwidth Data Transfer.​ Utilizing the Camera Link​ standard, the CR-GEN0-M6400R​ ensures lossless, deterministic transfer of its massive 30+ megapixel images. This is critical for inspection integrity, as compression artifacts from interfaces like USB3 or GigE could be mistaken for defects. The dedicated hardware interface provides stable, high-speed communication with frame grabbers, essential for synchronized triggering in multi-camera setups or with precision motion stages, guaranteeing image capture at the exact moment required.

Innovation Point 3: Industrial Hardening for Consistent Performance in Challenging Environments.​ Built for the factory floor, the camera features a ruggedized metal housing designed to withstand vibration, dust, and variable temperatures. This ensures that the precise optical alignment between the sensor and lens mount remains stable over time and across environmental shifts. This reliability is a core innovation, as it guarantees that the calibration and measurement results produced on day one remain valid months later, reducing maintenance downtime and recalibration costs.

Application Cases and Industry Value

Case Study: Printed Circuit Board (PCB) Assembly Final Verification

A leading automotive electronics supplier faced escalating quality demands for engine control units (ECUs). The final inspection required verifying the presence, placement, and solder quality of over 500 components on a complex multi-layer PCB. Manual inspection was slow and error-prone, while existing vision systems could not reliably inspect the fine-pitch Ball Grid Array (BGA) packages.

The solution was a custom optical inspection station built around four DALSA CR-GEN0-M6400R​ cameras. Each camera, equipped with telecentric lenses, was responsible for a quadrant of the PCB. The high resolution allowed each camera to image its section in a single shot with enough detail to inspect BGA solder ball coplanarity and bridge defects. The Camera Link​ outputs fed into a powerful industrial PC running specialized inspection software.

The impact was transformative. Inspection time per board dropped from 5 minutes (manual) to under 30 seconds. The defect escape rate fell to near zero, with the system catching issues like tombstoning and insufficient solder that were previously missed. The production manager reported: “The CR-GEN0-M6400R​ gave us the ‘microscope’ we needed for automation. Its consistency is remarkable—we haven’t had to recalibrate the station in months, despite running three shifts. It has become the cornerstone of our zero-defect delivery promise to the OEM.”